Aluminum based composite materials address the needs for lightweight and high-strength properties that current materials cannot to meet.  SiC/Al possesses a density comparable to aluminum, but its elastic modulus is two times higher than that of titanium alloy and three times higher than aluminum alloy. It exhibits an expansion coefficient similar to that of the chip and offers excellent thermal conductivity of over 240 (W/m · K). Consequently, it can replace the previous high-power semiconductor packaging material.