Electronic packaging:
Packaging materials are used to support and protect the metal base and shell of semiconductor chips, while the substrate, base plate, and shell of hybrid integrated circuit HIC form the best thermal conductivity, with a total dissipation power of tens of watts, full gas sealing, and a sturdy and reliable packaging structure, providing a highly reliable and stable working environment for chips and HICs. Specific material performance is a key issue of choice. The main characteristics of electronic metal materials commonly used for packaging are shown in the table below, indicating that the comprehensive performance of packaging type aluminum silicon carbide is significantly superior to other materials.
